1.1. SiC characteristics: The third-generation semiconductor star, with superior
The wafer ground by a wafer grinder refers to the silicon wafer used in the prod
Many enterprises require customized polishing of their products, especially for
晶圆减薄机是半导体制造工艺流程中必不可少的工具，通常是从晶圆没有电路结构的一面进行减薄。在晶圆减薄或切割之前，需要在晶圆具有电路结构的一面贴膜保护该电路结构。
