The fully automatic thinning machine is a high-precision grinding equipment equipped with a fully automatic upper and lower chip system. It uses a wafer manipulator to pick up chips and has automatic centering, cleaning, and drying functions. It can achie
Characteristic
● Sturdy structure
-Casting frame
-Superior design and workmanship
-Low surface damage and chip distortion
● Automatic thickness measurement system
● Automatic loading and unloading system
● Automatic cleaning and drying system
● PC system with simple interface and easy operation
● One click start, box in and box out, fully automatic processing
● Low failure rate, easy to maintain
Application
Silicon chips, silicon carbide chips, sapphire, metal, ceramics, glass, plastic, composite materials, LED molds, STRIP and composite materials, packaging materials, etc
