This series of equipment is a high-precision four axis single-sided polishing equipment, which can be equipped with copper plates, tin plates, stainless steel plates, etc. It is suitable for high-precision polishing of various semiconductor materials and
Characteristic
● Powerful structure
- 4-station independent cylinder pressurization, precise pressure control for all 4 stations
- C-type casting main frame
● Automatic ceramic disc positioning system
- Side positioning block cylinder, matched with center positioning device
● Optimized operating software
- 5-step control of pressure, speed, and time parameters, step-by-step pressure control in the cycle stage
● Cooling system: large plate and pressure plate
- Provide optimal DMP/CMP temperature conditions
- Maintain a flat state of the pressure plate during operation to ensure high-precision TTV of the product
● DMP turning tool device
- Self repair to ensure good flatness of the disc surface
- Excellent linear screw guide rail
● CMP polishing pad cleaning device
-Ensure that the polishing pad maintains optimal CMP conditions
Specifications
